We can offer you

Bonding of highly integrated circuits on all available substrates:
• Glas • Ceramics • Circuit boards • Foil
• Thermal or UV/visible gluing process

Precision imperative:
• Finest Pitch Bonding (e.g. HeatSeal, TAB, etc.)
• Pitches < 40 µm • Dimensions up to 25 mm in length

Our facilities:
• Clean room over 80 m² • Classification up to "1,000"
• Air-conditioning appropriate for processing ESD-sensitive components

We are at your side from the inception of an idea through to start of production:
Consulting - draft - prototyping - qualification - pilot series - series release - production